News screenshot of AMD's official website: the patent lawsuit was settled in three years, and two international semiconductor manufacturers shook hands

Recently, American chip manufacturers AMD and ADI announced on November 17 local time that they had reached a settlement on the previous legal dispute over semiconductor patents.
It is reported that this patent lawsuit originated from the lawsuit of ADM against the FPGA manufacturer Xilinsi in 2019.
In December 2019, ADI filed a patent infringement lawsuit against Xilinsi (now a subsidiary of AMD) in the Delaware District Court. ADI claims that without authorization, Xilinsi has used eight important patents of ADI analog-to-digital converter (ADC) technology in at least two high-end Zynq UltraScale+RFSoC products. ADI requested that Salins be prohibited from selling any product that infringes its patent and sought damages.
In February this year, AMD completed the acquisition of Xilinx at a high price of 49.8 billion US dollars, which also means that AMD has to face the lawsuit from ADI.
The trial of ADI claims was originally scheduled to begin in March this year. However, the court stayed the case last year and filed a patent validity lawsuit in the United States Patent and Trademark Office. After both parties reached an agreement, the case was withdrawn on November 14.

News screenshot of AMD official website

AMD and ADI did not publish specific agreement contents. ADI declined to comment, and AMD representatives did not immediately respond to requests for more information. However, from the outcome of reconciliation and commitment to cooperation, the benefits of cooperation between the two sides are greater than that of competition.
According to the data, Xilinx is the world's leading FPGA manufacturer. According to the data of the State Administration of Market Supervision, in 2020, Xilinx's FPGA market share in the world and China will be 50% - 55% and 50% - 55% respectively, ranking first.
Now, with the end of the patent dispute between AMD and ADI, the two major international semiconductor manufacturers are also making peace. In addition, the two sides also promised to carry out technical cooperation to provide communication and data center customers with next-generation solutions.